CPL-WB-00D3:Wide band directional coupler with ISO port

The CPL-WB-00D3 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA / TD-SCDMA / LTE applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, TD-SCDMA, WCDMA Band I, B7, B17, LTE) with less than 0.2 dB insertion losses in the transmit bandwidth (704 MHz to 2570 MHz).

The CPL-WB-00D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.

Key Features

  • 50 Ω nominal input / output impedance
  • Wide operating frequency range (704 MHz to 2570 MHz)
  • Low insertion Loss (< 0.2 dB)
  • 34 dB typical coupling factor
  • High directivity (typical 25 dB)
  • High ESD robustness (IEC 61000-4-2 Level 4)
  • Flip-Chip package
  • Small footprint: 1300 x 1000 μm
  • Benefits
    • Very low profile (< 690 μm)
    • Lead-free package
    • High RF performance
    • RF module size reduction
产品规格
DescriptionVersionSize
DS7193: Wide band directional coupler with ISO port2.0245 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
CPL-WB-00D3Chip Scale Package 0.4mm pitchTape And Reel50000.2151000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
CPL-WB-00D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-04_ld6(-wspc-cl0410u.pdf
md_6(-wspc-cspg-wspc-04_-wspc-ld6(-wspc-cl0410u.xml
Wide band directional coupler with ISO port CPL-WB-00D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_6(-wspc-cspg-wspc-04_ld6(-wspc-cl0410u.pdf CPL-WB-00D3
md_6(-wspc-cspg-wspc-04_-wspc-ld6(-wspc-cl0410u.xml CPL-WB-00D3