EMIF02-MIC03F2：2-line EMI filter and ESD protection for microphones

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

Key Features

EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming:1.07 mm x 1.47 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through integration and wafer level packaging
Complies with the following standards:
- 2 kV (air discharge)
- IEC 61000-4-2 Level 1, on output pins
  - 2 kV (air discharge)
  - 2 kV (contact discharge)
- MIL STD 883E - Method 3015-6 Class 3

产品规格

Description	Version	Size
DS4460: 2-line IPAD™, EMI filter and ESD protection	3.0	273 KB

应用手册

Description	Version	Size
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use	5.0	261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use	8.0	251 KB

Technical Notes & Articles

Description	Version	Size
TN1200: Micro-bump Flip Chip: package description and recommendations for use	1.0	280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches	4.0	330 KB