EMIF02-MIC03F2:2-line EMI filter and ESD protection for microphones

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

Key Features

  • EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consuming:1.07 mm x 1.47 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression
  • High reliability offered by monolithic integration
  • High reducing of parasitic elements through integration and wafer level packaging
  • Complies with the following standards:
    • 2 kV (air discharge)
    • IEC 61000-4-2 Level 1, on output pins
      • 2 kV (air discharge)
      • 2 kV (contact discharge)
    • MIL STD 883E - Method 3015-6 Class 3
产品规格
DescriptionVersionSize
DS4460: 2-line IPAD™, EMI filter and ESD protection3.0273 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-MIC03F2Chip Scale Package 0.5mm pitchTape And Reel0.228100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-MIC03F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qa-wspc-csp0.5-wspc-4-6_k9qa-wspc-emi2t7c.pdf
md_qa-wspc-csp0.xml
2-line IPAD™, EMI filter and ESD protection EMIF02-MIC03F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
md_qa-wspc-csp0.5-wspc-4-6_k9qa-wspc-emi2t7c.pdf EMIF02-MIC03F2
md_qa-wspc-csp0.xml EMIF02-MIC03F2