EMIF02-MIC03M6:2-line EMI filter and ESD protection for microphones

The EMIF02-MIC03M6 is a 2-line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 8 kV on all pins.

Key Features

  • EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consumption: 1.0 mm x 1.45 mm
  • Very thin package: 0.6 mm max
  • High efficiency in ESD suppression
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free and halogen-free package
  • Complies with following standards
    • 8 kV (contact discharge)
    • IEC 61000-4-2 level 4 requirements
      • 8 kV (contact discharge)
      • 15 kV (air discharge)
产品规格
DescriptionVersionSize
DS5720: 2-line IPAD™, EMI filter and ESD protection for microphone2.1324 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
The ultimate HDMI control-link buffer2.1478 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-MIC03M6uQFN-6LTape And Reel0.331000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-MIC03M6uQFN-6LIndustrialEcopack2md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_espq-wspc-em2t11a_vers2_sdm_signed.pdf
md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_espq-wspc-em2t11a_vers2.xml
2-line IPAD™, EMI filter and ESD protection for microphone EMIF02-MIC03M6
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_espq-wspc-em2t11a_vers2_sdm_signed.pdf EMIF02-MIC03M6
md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_espq-wspc-em2t11a_vers2.xml EMIF02-MIC03M6