EMIF03-SIM02C2：3-line EMI filter and ESD protection for SIM card interfaces

The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which protects the application from damage when subjected to ESD surges up 15 kV.

Key Features

EMI symmetrical (I/O) low-pass filter
high efficiency in EMI filtering
lead-free coated package
very low PCB space occupation:
- 1.42 mm x 1.42 mm
very thin package: 0.65 mm
high efficiency in ESD suppression
high reliability offered by monolithic integration
high reduction of parasitic elements through integration and wafer level packaging
Complies with following standards:
- IEC 61000-4-2 level 4 on external and VCC pins:
  - 15 kV (air discharge)
  - 8 kV (contact discharge)
- MIL STD 883G - Method 3015-7 Class 3

产品规格

Description	Version	Size
DS5131: 3-line IPAD™ EMI filter including ESD protection	3.1	180 KB

应用手册

Description	Version	Size
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices	1.1	1 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use	5.0	261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use	8.0	251 KB