EMIF03-SIM02M8:3-line EMI filter and ESD protection for SIM card interfaces

The EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external pins.

Key Features

  • Low clamping voltage
  • Easy layout and flexibility thanks to I/O topology
  • High reduction of parasitic elements through integration and wafer level packaging.
  • High reliability offered by monolithic integration
  • SIM card EMI low-pass filter
  • Very low PCB space consumption: 1.7 mm x 1.5 mm
  • High efficiency in EMI filtering
  • High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4).
  • Lead free package
  • Very thin package: 0.6 mm max
产品规格
DescriptionVersionSize
DS5513: 3 line IPAD™, EMI filter for SIM card applications1.2376 KB
应用手册
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
Single chip IPADTM memory card transceiver1.0567 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF03-SIM02M8uQFN-8LTape And Reel0.3141000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF03-SIM02M8uQFN-8LIndustrialEcopack2md_tv-wspc-dfn.17.15.06-040-8l-e_ectv-wspc-emi3t2h.pdf
md_tv-wspc-dfn.xml
3 line IPAD™, EMI filter for SIM card applications EMIF03-SIM02M8
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF03-SIM02F3
md_tv-wspc-dfn.17.15.06-040-8l-e_ectv-wspc-emi3t2h.pdf EMIF03-SIM02M8
md_tv-wspc-dfn.xml EMIF03-SIM02M8