EMIF03-SIM04F3:3-line EMI filter and ESD protection for SIM card interfaces

The EMIF03-SIM04F3 Flip Chip is a low capacitance EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV.

Key Features

  • EMI symmetrical (I/O) low-pass filter
  • high efficiency in EMI/ESD protection
  • lead-free package
  • very thin package
  • high reliability offered by monolithic integration
  • high reduction of parasitic elements through integration and wafer level packaging
  • Complies with the following standards
    • ± 2 kV (air discharge)
    • IEC 61000-4-2 level 1:
      • ± 2 kV (air discharge)
      • ± 2 kV (contact discharge)
产品规格
DescriptionVersionSize
DS6699: 3-line IPAD™, EMI filter including ESD protection2.1185 KB
应用手册
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF03-SIM04F3 S-parameter model (.sxp)1.0525 KB
宣传册
DescriptionVersionSize
Single chip IPADTM memory card transceiver1.0567 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF03-SIM04F3Chip Scale Package 0.4mm pitchTape And Reel0.1571000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF03-SIM04F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_n0-wspc-csps0.4-wspc-11-16_kdn0-wspc-emi3t4b.pdf
md_n0-wspc-csps0.xml
3-line IPAD™, EMI filter including ESD protection EMIF03-SIM04F3
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF03-SIM04F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF03-SIM02F3
md_n0-wspc-csps0.4-wspc-11-16_kdn0-wspc-emi3t4b.pdf EMIF03-SIM04F3
md_n0-wspc-csps0.xml EMIF06-MSD04F3