EMIF06-1005M12:6-line low capacitance EMI filter and ESD protection

The EMIF06-1005M12 is a 6-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input pins.

Key Features

  • High reduction of parasitic elements through integration and wafer level packaging
  • High reliability offered by monolithic integration
  • EMI symmetrical (I/O) low-pass filter
  • Very low PCB space consumption: 2.5 mm x 1.5 mm
  • High efficiency in EMI filtering: -34 dB at frequencies from 900 MHz to 1.8 GHz
  • High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
  • Lead-free package
  • Very thin package: 0.6 mm max
产品规格
DescriptionVersionSize
DS4831: 6-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package3.2176 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
手册
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-1005M12uQFN-12LTape And Reel0.244100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-1005M12uQFN-12LIndustrialEcopack2md_t3-wspc-vfqfpn-wspc-2.5x1.5-wspc-12l_est3emi6t6a-wspc-(emif06-1005m12)-wspc-ver2_signed.pdf
md_t3-wspc-vfqfpn-wspc-2.5x1.5-wspc-12l_est3emi6t6a-wspc-(emif06-1005m12)-wspc-wcp-wspc-ver2.xml
6-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package EMIF06-1005M12
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
STM8L101xx device limitations STM8L101G3
md_t3-wspc-vfqfpn-wspc-2.5x1.5-wspc-12l_est3emi6t6a-wspc-(emif06-1005m12)-wspc-ver2_signed.pdf EMIF06-1005M12
md_t3-wspc-vfqfpn-wspc-2.5x1.5-wspc-12l_est3emi6t6a-wspc-(emif06-1005m12)-wspc-wcp-wspc-ver2.xml EMIF06-1005M12