EMIF06-1005N12:6-line low capacitance EMI filter and ESD protection

EMIF06-1005N12 is a 6-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input pins.

Key Features

  • EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering at frequencies from 900 MHz to 1.8 GHz
  • Very low PCB space consumption:2.5 mm x 1.2 mm
  • Very thin package: 0.55 mm max
  • High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free package
  • Complies with the following standards
    • IEC 61000-4-2 level 4 input and output pins
      • + 15 kV (air discharge)
      • + 8 kV (contact discharge)
    • MIL STD 883G - Method 3015-7 Class 3B(all pins)
产品规格
DescriptionVersionSize
DS6667: 6-line IPAD™, low capacitance EMI filter and ESD protection in narrow micro QFN package2.1385 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-1005N12uQFN-12LTape And Reel0.34100NECEAR99MALAYSIA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-1005N12uQFN-12LIndustrialEcopack2md_a0ay-wspc-dfn-wspc-2.5x1.2-wspc---wspc-12l_ecayemi6t6a.pdf
md_a0ay-wspc-dfn-wspc-2.xml
6-line IPAD™, low capacitance EMI filter and ESD protection in narrow micro QFN package EMIF06-1005N12
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_a0ay-wspc-dfn-wspc-2.5x1.2-wspc---wspc-12l_ecayemi6t6a.pdf EMIF06-1005N12
md_a0ay-wspc-dfn-wspc-2.xml EMIF06-1005N12