EMIF06-HSD03F3：6-line EMI filter with integrated ESD protection for micro-SD Card™

The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.

Key Features

Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
Very low PCB space consumption:
- 1.1 x 2.4 mm
Ultralow leakage current: 20 nA max.
Very thin package: 0.605 mm
Smart pinout for easier PCB layout
High reduction of parasitic elements through integration and wafer level packaging
Lead-free package
Complies with the following standards:
- IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)

产品规格

Description	Version	Size
DS9928: EMI filter with integrated ESD protection for micro-SD Card™	4.0	560 KB

应用手册

Description	Version	Size
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices	1.1	1 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use	5.0	261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use	8.0	251 KB