EMIF10-COM01F2:10-line EMI filter and ESD protection for display interfaces

The EMIF10-COM01F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size.

Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.

Key Features

  • High reliability offered by monolithic integration
  • EMI symmetrical (I/O) low-pass filter
  • Very low PCB space consuming: < 6 mm2
  • Lead free package
  • High efficiency in ESD suppression on both input & output pins
  • Very thin package: 0.65 mm
产品规格
DescriptionVersionSize
DS4185: 10-line IPAD™, EMI filter including ESD protection5.1181 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF10-COM01F2Chip Scale Package 0.5mm pitchTape And Reel0.54550NECEAR99-
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF10-COM01F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qe-wspc-csps0.xml
10-line IPAD™, EMI filter including ESD protection EMIF10-COM01F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_qe-wspc-csps0.xml EMIF10-COM01F2