The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330 has a user-selectable full-scale acceleration range of ±2/±4/±6/±8/±16 g and an angular rate range of ±250/±500/±2000 dps. The accelerometer and gyroscope sensors can be either activated or separately put in power-down / sleep mode for applications optimized for power saving.
The LSM330 is available in a plastic land grid array (LGA) package.
Key Features
Description | Version | Size |
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DS9160: iNEMO inertial module: 3D accelerometer and 3D gyroscope | 3.0 | 1 MB |
Description | Version | Size |
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TN0018: Surface mounting guidelines for MEMS sensors in an LGA package | 5.0 | 218 KB |
Description | Version | Size |
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MEMS and Sensors, Smart solutions for IoT and enhanced user experience | 1 MB |
型号 | 制造商 | Description |
---|---|---|
STEVAL-MKI173V1 | ST | LSM303AH adapter board for standard DIL24 socket |
型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|---|
LSM330TR | TFLGA 3.5X3X1 24L | Tape And Reel | 2.228 | 1000 | NEC | EAR99 | - |
型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
LSM330TR | TFLGA 3.5X3X1 24L | Industrial | Ecopack2 | md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2_signed.pdf md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2.xml |