LSM330:iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LSM330 has a user-selectable full-scale acceleration range of ±2/±4/±6/±8/±16 g and an angular rate range of ±250/±500/±2000 dps. The accelerometer and gyroscope sensors can be either activated or separately put in power-down / sleep mode for applications optimized for power saving.

The LSM330 is available in a plastic land grid array (LGA) package.

Key Features

  • Analog supply voltage: 2.4 V to 3.6 V
  • Digital supply voltage IOs: 1.8 V
  • Power-down and sleep modes
  • 2 embedded programmable state machines
  • 3 independent acceleration channels and 3 angular rate channels
  • ±2/±4/±6/±8/±16 g selectable full scale
  • ±250/±500/±2000 dps selectable full scale
  • SPI/I2 C serial interface
  • Embedded temperature sensor
  • Embedded FIFO
  • ECOPACK® RoHS and “Green” compliant
产品规格
DescriptionVersionSize
DS9160: iNEMO inertial module: 3D accelerometer and 3D gyroscope3.01 MB
Technical Notes & Articles
DescriptionVersionSize
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package5.0218 KB
Design Notes & Tips
DescriptionVersionSize
DT0060: Exploiting the gyroscope to update tilt measure and e-compass1.0226 KB
DT0047: How to install and run the osxMotionAR Activity Recognition library1.1273 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance1.0616 KB
手册
DescriptionVersionSize
MEMS and Sensors, Smart solutions for IoT and enhanced user experience1 MB
Product Evaluation Tools
型号制造商Description
STEVAL-MKI173V1STLSM303AH adapter board for standard DIL24 socket
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
LSM330TRTFLGA 3.5X3X1 24LTape And Reel2.2281000NECEAR99-
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
LSM330TRTFLGA 3.5X3X1 24LIndustrialEcopack2md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2_signed.pdf
md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2.xml
iNEMO inertial module: 3D accelerometer and 3D gyroscope LSM330
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Exploiting the gyroscope to update tilt measure and e-compass LSM303DLHC
How to install and run the osxMotionAR Activity Recognition library X-NUCLEO-IKS01A1
Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance STEVAL-STLKT01V1
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2_signed.pdf LSM330
md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_-wspc-21aamv3gaaa-wspc-(lsm9ds1tr)-wspc-wcp-wspc-ver2.xml LSM330