LSM6DS33:iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM6DS33 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS33 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS33 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS33 the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS33 is available in a plastic land grid array (LGA) package.

Key Features

  • Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 8 kbyte based on features set
  • Compliant with Android K and L
  • ±2/±4/±8/±16 g full scale
  • ±125/±245/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IOs supply (1.62 V)
  • Compact footprint, 3 mm x 3 mm x 0.86 mm
  • SPI/I2 C serial interface with main processor data synchronization feature
  • Embedded temperature sensor
  • ECOPACK® , RoHS and “Green” compliant
产品规格
DescriptionVersionSize
DS10847: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope5.01 MB
应用手册
DescriptionVersionSize
AN4682: LSM6DSD33: always-on 3D accelerometer and 3D gyroscope3.01 MB
Technical Notes & Articles
DescriptionVersionSize
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package5.0218 KB
Design Notes & Tips
DescriptionVersionSize
DT0060: Exploiting the gyroscope to update tilt measure and e-compass1.0226 KB
DT0047: How to install and run the osxMotionAR Activity Recognition library1.1273 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance1.0616 KB
手册
DescriptionVersionSize
MEMS and Sensors, Smart solutions for IoT and enhanced user experience1 MB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
LSM6DS33TRVFLGA 3X3X0.86Tape And Reel1.7711000NECEAR99-
LSM6DS33VFLGA 3X3X0.86Tray-1000NECEAR99-
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
LSM6DS33TRVFLGA 3X3X0.86IndustrialEcopack2md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2_signed.pdf
md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2.xml
LSM6DS33VFLGA 3X3X0.86IndustrialEcopack2md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2_signed.pdf
md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2.xml
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope LSM6DS33
LSM6DSD33: always-on 3D accelerometer and 3D gyroscope LSM6DS33
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Exploiting the gyroscope to update tilt measure and e-compass LSM303DLHC
How to install and run the osxMotionAR Activity Recognition library X-NUCLEO-IKS01A1
Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance STEVAL-STLKT01V1
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2_signed.pdf LSM6DS33
md_a0zs-wspc-vflga-wspc-3x3x0.86_21aamv7daaa-wspc-(lsm6ds33tr)-wspc-ver2.xml LSM6DS33