The LSM9DS1 is a system-in-package featuring a 3D digital linear acceleration sensor, a 3D digital angular rate sensor, and a 3D digital magnetic sensor.
The LSM9DS1 has a linear acceleration full scale of ±2g/±4g/±8/±16 g, a magnetic field full scale of ±4/±8/±12/±16 gauss and an angular rate of ±245/±500/±2000 dps.
The LSM9DS1 includes an I2C serial bus interface supporting standard and fast mode (100 kHz and 400 kHz) and an SPI serial standard interface.
Magnetic, accelerometer and gyroscope sensing can be enabled or set in power-down mode separately for smart power management.
The LSM9DS1 is available in a plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Key Features
Description | Version | Size |
---|---|---|
DS10101: iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer | 3.0 | 1 MB |
Description | Version | Size |
---|---|---|
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package | 5.0 | 218 KB |
Description | Version | Size |
---|---|---|
MEMS and Sensors, Smart solutions for IoT and enhanced user experience | 1 MB |
型号 | 制造商 | Description |
---|---|---|
STEVAL-MKI159V1 | ST | LSM9DS1 adapter board for standard DIL24 socket |
型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|---|
LSM9DS1TR | TFLGA 3.5X3X1 24L | Tape And Reel | 3.229 | 1000 | NEC | EAR99 | - |
型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
LSM9DS1TR | TFLGA 3.5X3X1 24L | Industrial | Ecopack2 | md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_22ccmv3gbba-wspc-(lsm9ds1tr)-wspc-vers2_wpc_signed.pdf md_a0p8-wspc-tflga-wspc-3.5x3x1-wspc-24l_22ccmv3gbba-wspc-(lsm9ds1tr)vers2_wpc.xml |