• 简体中文
• English

STM32F412RE：STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, ARM Cortex-M4 MCU with 512 Kbytes Flash, 100 MHz CPU, Art Accelerator, DFSDM

The STM32F412xE/G devices are based on the high-performance ARM^®Cortex^® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex^®-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F412xE/G belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.

The STM32F412xE/G incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbyte of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timer for motor control and two general-purpose 32-bit timers.

They also feature standard and advanced communication interfaces.

Key Features

• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
• Core: ARM® 32-bit Cortex® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
  • Up to 1 Mbyte of Flash memory
  • 256 Kbyte of SRAM
  • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
  • Dual mode Quad-SPI interface
• LCD parallel interface, 8080/6800 modes
• Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
• Power consumption
  • Run: 112 μA/MHz (peripheral off)
  • Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C
  • Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C
  • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
  • VBAT supply for RTC: 1 μA @25 °C
• 1×12-bit, 2.4 MSPS ADC: up to 16 channels
• 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
• General-purpose DMA: 16-stream DMA
• Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer
• Debug mode
  • Serial wire debug (SWD) & JTAG
  • Cortex® -M4 Embedded Trace Macrocell™
• Up to 114 I/O ports with interrupt capability
  • Up to 109 fast I/Os up to 100 MHz
  • Up to 114 five V-tolerant I/Os
• Up to 17 communication interfaces
  • Up to 4x I2 C interfaces (SMBus/PMBus)
  • Up to 4 USARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
  • Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
  • SDIO interface (SD/MMC/eMMC)
  • Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
  • 2x CAN (2.0B Active)
• True random number generator
• CRC calculation unit
• 96-bit unique ID
• RTC: subsecond accuracy, hardware calendar
• All packages are ECOPACK® 2

产品规格

应用手册

Technical Notes & Articles

参考手册

编程手册

勘误手册

Device Option Lists

HW Model & CAD Libraries

简报

宣传册

手册

Product Certifications

Hardware Development Tools

Software Development Tools

MCUs Embedded Software

Product Evaluation Tools

样片和购买

质量和可靠性