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SiHD3N50D D Series Power MOSFET

技术特性

• Optimal design
• Low area specific on-resistance
• Low input capacitance (Ciss)

Datasheet

• SiHD3N50D

General Information

• General Information - Useful Web Links

Package Drawings

• Package Information - TO-252AA Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

RC Thermal Models

• SiHD_U3N50D_RC - R-C Thermal Model Parameters

Reliability Data

• Package Reliability - Environmental and Package Testing Data for DPAK (TO-252), IPAK (HVM)
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result

Tape Info

• 90-2339-1 - Tape Drawing for TO-252 (DPAK) (T1 Method)
• 90-2369-x - Tape Drawing for TO-252 (DPAK) (T4 Method)
• Device Orientation - Device Orientation for TO-252 and TO-263 (T5)