ADL5570 2.3 GHz TO 2.4 GHz WiMAX Power Amplifier

The ADL5570 is a high linearity 2.3 GHz to 2.4 GHz power amplifier designed for WiMAX terminals using TDD operation at a duty cycle of 31%. With a gain of 29 dB and an output compression point of 31 dBm at 2.35 GHz, it can operate at an output power level up to 26 dBm while maintaining an EVM of ≤3% (OFDM 16 or 64 QAM) with a supply voltage of 3.5 V. PAE is 20% @ POUT = 25 dBm. WiMAX/WiBro mobile terminals

The ADL5570 RF input is matched on-chip and provides an input return loss of less than −10 dB. The open-collector output is externally matched with strip-line and external shunt capacitance.

The ADL5570 operates over a supply voltage range from 3.2 V to 4.2 V with a supply current of 440 mA burst rms when delivering 25 dBm (3.5 V supply). A low power mode is also available for operation at power levels of ≤10 dBm with optimized operating and quiescent currents of 100 mA and 70 mA, respectively. A standby mode is available that reduces the quiescent current to 1 mA, which is useful when a TDD terminal is receiving data.

The ADL5570 is fabricated in a GaAs HBT process and is packaged in a 4 mm × 4 mm, 16-lead, Pb-free RoHS-compliant LFCSP that uses an exposed paddle for excellent thermal impedance. It operates from −40°C to +85°C.

Data Sheet, Rev. 0, 6/07

Features and Benefits
  • Fixed gain of 29 dB
  • Operation from 2.3 GHz to 2.4 GHz
  • EVM ≤ 3% at POUT = 25 dBm with 16 QAM OFDMA
  • Quiescent current
    130 mA in high power mode
    70 mA in low power mode 
  • Input internally matched to 50 Ω
  • Power supply: 3.2 V to 4.2 V
  • Power-added efficiency (PAE): 20%
  • Multiple operating modes to reduce battery drain
    Low power mode: 100 mA
    Standby mode: 1mA
    Sleep mode: <1 μA 
  • RF & Microwave
    Data Sheets
    Documentnote
    ADL5570: 2.3 GHz to 2.4 GHz WiMAX Power Amplifier Data Sheet (Rev. 0)PDF 347 kB
    Application Notes
    Documentnote
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 133.7 K
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 439 kB
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    AD8372ACPZ-R7 Production32 ld LFCSP (5x5mm)REEL 1500-40 to 85C06.58Y
    AD8372ACPZ-WP Production32 ld LFCSP (5x5mm)REEL 36-40 to 85C9.119.11Y
    Evaluation Boards
    Part NumberDescriptionPriceRoHS
    AD8372-EVALZEvaluation Board99Y
    ADL5570: 2.3 GHz to 2.4 GHz WiMAX Power Amplifier Data Sheet (Rev. 0) adl5570
    AN-1389: 引线框芯片级封装(LFCSP)的建议返修程序 (Rev. 0) ad9540
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856
    AN-772: 引脚架构芯片级封装(LFCSP)设计与制造指南 (Rev. 0) ad9540
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856