HMC414 InGaP HBT Power Amplifier SMT, 2.2 - 2.8 GHz

The HMC414MS8G(E) is a high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC Power amplifier which operates between 2.2 and 2.8 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance. With a minimum of external components, the amplifier provides 20 dB of gain, +30 dBm of saturated power at 32% PAE from a +5V supply voltage. The amplifier can also operate with a 3.6V supply. Vpd can be used for full power down or RF output power/ current control.

Applications
  • BLUETOOTH
  • MMDS
Features and Benefits
  • Gain: 20 dB
  • Saturated Power: +30 dBm
  • 32% PAE
  • Supply Voltage: +2.75V to +5V
  • Power Down Capability
  • Low External Part Count
  • Amplifiers
    S-Parameters
    Data Sheets
    Documentnote
    HMC414 Data SheetPDF 594.64 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    HMC414MS8GE Production8 ld MSOP_EPOTH 50-40 to 85C6.25.02Y
    HMC414MS8GETR Production8 ld MSOP_EPREEL 500-40 to 85C6.25.02Y
    Evaluation Boards
    Part NumberDescriptionPriceRoHS
    105006-HMC414MS8GEvaluation Board - HMC414MS8G Evaluation PCB347.13Y
    Reference Materials
    HMC414 Data Sheet hmc414
    HMC414 S-Parameter hmc414
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    Semiconductor Qualification Test Report: GaAs HBT-B (QTR: 2013-00229) hmc311sc70
    Package/Assembly Qualification Test Report: MS8G (QTR: 2014-00393) hmc536ms8g
    PCN: MS, QS, SOT, SOIC packages - Sn/Pb plating vendor change hmc536ms8g
    HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of... hmc536ms8g
    MSOP 8 & 10 Tape Specification (MS8, MS8G, MS10, MS10G) hmc349ams8g