HSMF-C118 Tri-color Surface Top Mount chipLED

The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity.

Features
  • Common anode
  • Small 3.2 x 2.7 x 1.1 mm package
  • Diffused optics
  • Red/Green/Blue color combination
  • Available in 8 mm tape on 7 inch (178 mm) diameter reels
  • High brightness using AlInGaP and InGaN die technology
  • Compatible with reflow soldering
Applications
  • Backlighting
  • Status indicator
  • Front panel indicator
  • Office automation, home appliances, industrial equipment
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Samples AvailableYes
ColorRed, Green & Blue
Color Bin SelectionOpen
Dimension Lxwxh In Mm3.2 x 2.7 x 1.1
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeGaP
Lens TypeFlat Top, Diffused, Untinted
Peak Output Current Min (A)1999
Max Qty of Samples20
Minimum Luminous Intensity (mcd)2.5
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsTricolor
PackageTri-Color
ROHS5_NonLeadFreeY
Test Current (mA)20.0
Typical Forward Voltage In V3.6
Typical Dominant Wavelength (nm)626 & 525 & 471
Typical Luminous Intensity (mcd)90 & 120 & 140
Viewing Angle (degree)140° & 145° & 145°
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (5)
Reliability Data Sheet (1)