HSMG-C170 Surface Mount ChipLEDs HSMG-C170

This chip LED is designed in an industry standard package for ease of handling and use. The HSMG-C170 has the widely used 2.0 x 1.25 mm footprint. This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.

Features
  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40°C to 85°C
  • Right Angle & Reverse Mount Package Available
  • Various Colors Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
Applications
  • Keypad Backlighting
  • Push-Button Backlighting
  • LCD Backlighting
  • Symbol Backlighting
  • Front Panel Indicator Reels
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Color Bin SelectionOpen
Dimension Lxwxh In Mm2.0 x 1.25 x 0.8
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeGaP
Max Qty of Samples20
Minimum Luminous Intensity (mcd)4.0
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsSingle
Operating Temperature Range-40°C to +85°C
PackageTape and Reel
Test Current (mA)20.0
Typical Dominant Wavelength (nm)572
Typical Luminous Intensity (mcd)15
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (4)
Reliability Data Sheet (1)