DLLFSD01LP3：Small Signal Switching Diodes
| Part Number | Data Sheet | SPICE Model | Qualified to AECQ10x | PPAP Capable | Configuration | Polarity | Power Rating (mW) | ESD Diodes (Y/N) | TotalCapacitance CT (pF) | Peak RepetitiveReverse VoltageVRRM (V) | Reverse Recovery Time trr (ns) | Maximum Average Rectifier Current IO (mA) | Maximum Peak Forward Surge Current IFSM (A) | Forward Voltage Drop VF @ IF (V) | Forward Voltage Drop VF @ IF (mA) | Maximum ReverseCurrent IR (µA) | Maximum Reverse Current IR @ VR (V) | V(BR)R (V) Min @IR=100μA | VF(V) Max @ IF=1.0mA | VF(V) Max @ IF=10mA | VF(V) Max @ IF=100mA | IR(nA) Max @ VR=5V | IR(uA) Max @ VR=30V | IR(uA) Max @ VR=80V | CT(pF) Max @ VR = 0V, f = 1MHz | Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω |
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| DLLFSD01LP3 | DLLFSD01LP3.pdf | DLLFSD01LP3 | No | No | - | Anode, Cathode | 200 | No | - | 80 | 4 | 100 | 2 | 0.94 | 100 | 0.01 | 5 | 80 | 0.7 | 0.82 | 1.2 | 10 | 0.1 | 0.2 | 2.5 | 4 |
Description
- Case: X3-DFN0603-2
- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
- Moisture Sensitivity: Level 1 per J-STD-020
- Terminal Connections: Cathode Bar
- Terminals: Finish — Matte Tin Finish over Copper Leadframe
- (Lead-Free Plating). Solderable per MIL-STD-202, Method 208
- Weight: 0.0002 grams (Approximate)
Features
- Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
- Ultra-Low Profile Package (0.3mm)
- Fast Switching Speed, Fast Reverse Recovery Time
- Ultra-Low Reverse Leakage Current (~ 5nA @ VR = 5V)
- Very Low Capacitance (<1pF @ VR=0V)
- Totally Lead-Free & Fully RoHS Compliant
- Halogen and Antimony Free. “Green” Device
Ordering Information
X3-DFN0603-2
