FDZ191P: -20V P-Channel 1.5V Specified PowerTrench® WL-CSP MOSFET

Designed on Fairchild's advanced 1.5V PowerTrench process with state of the art "low pitch" WLCSP packaging process, the FDZ191P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on). .

Features

• Max r_DS(on) = 85mΩ at V_GS = -4.5V, I_D = -1A
  
• Max r_DS(on) = 123mΩ at V_GS = -2.5V, I_D = -1A
  
• Max r_DS(on) = 200mΩ at V_GS = -1.5V, I_D = -1A
  
• Occupies only 1.5 mm² of PCB area Less than 50% of the area of 2 x 2 BGA
  
• Ultra-thin package: less than 0.65 mm height when mounted to PCB
  
• RoHS Compliant
  

Application Notes