FF450R06ME3

EconoDUAL™ 3 600V chopper IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC

ParametricFF450R06ME3
ConfigurationDual
IC(nom) / IF(nom)400.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEconoDUAL™ 3
Sales Product NameFF450R06ME3
OPNFF450R06ME3BOSA1
Product Statusnot for new design
Package NameAG-ECONOD-3
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Trench IGBT3
  • T(vj op) = 150°C
  • V(CEsat) with positive Temperature Coefficient
  • High Power Density
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Diagrams
Data Sheet
TitleSizeDateVersion
FF450R06ME3 (german/english),EN/DE,EN/CN,EN/JA620 KB03 Dec 201303_02
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05)；EN；CN630 KB05 Feb 2008
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules；EN；CN1.9 MB05 May 2011
Mounting instructions EconoDUAL™ 3 Modules；EN；DE；CN818 KB10 Feb 2014
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Module Adapter Board for EconoDUAL™3 IGBT Modules；EN1.1 MB14 Feb 2010
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Characteristic differences between 1200V IGBT3 modules of E3 and T3 series；EN；CN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 Apr 201607_00
Article
TitleSizeDateVersion
Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014；DE512 KB14 May 2014
FPGA to Control Power Electronics；EN246 KB01 Oct 2014
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
„Econo“ my improvement in inverter-converter-moduldesign；EN90 KB07 Feb 2014
IGBT Module technology state of the art and future evolutions；EN37 KB07 Feb 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Traction Systems；EN1.5 MB27 Apr 201608_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoDUAL 3；EN529 KB06 Jan 201404_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
EN/CN FF450R06ME3
EN/DE FF450R06ME3
EN/JA FF450R06ME3
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JA IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN 2ED300C17-ST
EN 2ED300C17-ST
CN IFS75B12N3E4_B32
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CN 6ED100E12-F2
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EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
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