FF450R06ME3

EconoDUAL™ 3 600V chopper IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC

ParametricFF450R06ME3
ConfigurationDual
IC(nom) / IF(nom)400.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEconoDUAL™ 3
Sales Product NameFF450R06ME3
OPNFF450R06ME3BOSA1
Product Statusnot for new design
Package NameAG-ECONOD-3
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Trench IGBT3
  • T(vj op) = 150°C
  • V(CEsat) with positive Temperature Coefficient
  • High Power Density
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
FF450R06ME3 (chinese/english),EN/CN,EN/DE,EN/JA863 KB03 十二月 201303_02
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
评估板_AN2007_05_2ED300E17_SFO；CN；EN1,023 KB04 十一月 201501_01
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
模块的评估驱动板；CN；EN2.3 MB25 十一月 2013
安装说明 EconoDUAL™3 模块；CN；EN；DE924 KB20 八月 2012
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
Module Adapter Board for EconoDUAL™3 IGBT Modules；EN1.1 MB14 二月 2010
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
E3和T3系列1200V IGBT3 模块的性能差异；CN；EN330 KB25 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
Article
TitleSizeDateVersion
Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014；DE512 KB14 五月 2014
FPGA to Control Power Electronics；EN246 KB01 十月 2014
Editorials
TitleSizeDateVersion
„Econo“ my improvement in inverter-converter-moduldesign；EN90 KB07 二月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoDUAL 3；EN529 KB06 一月 201404_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN FF450R06ME3
EN/DE FF450R06ME3
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