1PS76SB17: 4 V, 30 mA low capacitance Schottky barrier diode
Planar low capacitance Schottky barrier diode encapsulated in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package.
1PS76SB17: Product Block Diagram
1PS76SB17: Block Diagram
1PS76SB17: Block Diagram
1PS76SB17: Block Diagram
sod323_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 4 V, 30 mA low C_d Schottky barrier diode (REV 6.0) PDF (50.0 kB) 1PSXSB17 | 04 Apr 2005 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| 1PS76SB17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS76SB17 | 31 Jan 2015 |
| 1PS76SB17 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS76SB17_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- 1PS76SB17 SPICE model (REV 1.4) prm 1PS76SB17_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS76SB17 | Active | SOD323 | SOD323 | 1.7 x 1.25 x 0.95 | single | 450@IF=1mA | 1@VR=0V | 0.25@VR=3V | 4 | 30 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS76SB17 | | SOD323 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | 1PS76SB17,115 (9340 454 00115) | S7 | 1PS76SB17 |    | week 31, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- 1PS76SB17 NXP® Product Reliability 1PS76SB17
- 1PS76SB17 NXP Product Quality 1PS76SB17
- 1PS76SB17 SPICE model 1PSXSB17
- plastic surface-mounted package; 2 leads pesd5v0v1ba
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba
- 1PSXSB17
- 1PSXSB17
- 1PSXSB17
- BB208-03
