74LVC1G175GW: Single D-type flip-flop with reset; positive edge trigger
The 74LVC1G175 is a low-power, low-voltage single positive edge triggered D-type flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q output.
The master reset (MR) is an asynchronous active LOW input and operates independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation.
The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.
74LVC1G175GW: Product Block Diagram
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Single D-type flip-flop with reset; positive edge trigger (REV 6.0) PDF (201.0 kB) 74LVC1G175 [English] | 11 Oct 2013 |
Application Notes (5)
| Name/Description | Modified Date |
|---|---|
| Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
| Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
| Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
| PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English] | 30 Oct 2002 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
| TSSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (188.0 kB) SOT363_165 [English] | 20 Nov 2012 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
IBIS Model
- 74LVC1G175 IBIS model (REV 1.0) ibs LVC1G175 10/21/2014
Ordering Information
| Product | Status | Family | VCC (V) | Function | Logic switching levels | Description | Package version | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | No of pins |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G175GW | Active | LVC | 1.65 - 5.5 | D-type flip-flops | CMOS/LVTTL | positive-edge trigger | SOT363 | +/- 32 | 3.1 | 300 | low | -40~125 | 265 | 39.1 | 154 | TSSOP6 | 6 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G175GW | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74LVC1G175GW,125 (9352 749 48125) | YT | 74LVC1G175GW |    | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
- Sorting through the low voltage logic maze 74LVC_H_245A_Q100
- Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
- Pin FMEA for LVC family 74LVC1G123_Q100
- MicroPak soldering information NTS0102_Q100
- PicoGate Logic footprints NX3L4684
- TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
- MAR_SOT363 Topmark BSS84AKS
- 74LVC1G175 IBIS model 74LVC1G175GW
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- 74LVC1G175
- BFU520Y
