BLM6G22-30(G)：W-CDMA 2100 MHz至2200 MHz功率MMIC
30 W LDMOS 2级功率MMIC，适用于2100 MHz至2200 MHz频率范围的基站应用。提供鸥翼式引脚表面贴装(SOT822-1)或扁平引脚(SOT834-1)。
特性和优势
应用
| 产品图片 |
关键参数
| 型号 | Package version | frange [min] (MHz) | frange [max] (MHz) | PL(1dB) (W) | VDS (V) | η (%) | GP (dB) | Test signal | Product status |
|---|---|---|---|---|---|---|---|---|---|
| BLM6G22-30G | SOT822-1 | 2100 | 2200 | 30 | 28 | 9 | 29.5 | 2-c WCDMA; 2-c WCDMA | Production |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM6G22-30G |  HSOP16 (SOT822-1) | sot822-1_po | sot822-1_fr | Reel 13" Q1/T1 | 量产 | Standard Marking | BLM6G22-30G,118( 9340 603 04118 ) |
| Reel 11¼" Q1/T1 in LargePack | 量产 | Standard Marking | BLM6G22-30G,135( 9340 603 04135 ) |
停产信息
| 型号 | 订购码 (12NC) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 |
|---|---|---|---|---|
| BLM6G22-30G | 934060304127 |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLM6G22-30G | BLM6G22-30G,118 |   | 3 | 3 | |
| BLM6G22-30G | BLM6G22-30G,135 | | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLM6G22-30_BLM6G22-30G (中文) | W-CDMA 2100 MHz to 2200 MHz power MMIC | Data sheet | 2011-03-07 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLM6G22-30_BLM6G22-30G_Data-sheet | PCB Design BLM6G22-30(G) (Data sheet) | Design support | zip | 2012-02-24 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| BLM6G22-30_ADS-2009_Model | BLM6G22-30 ADS-2009 Model | Simulation model | zip | 2013-02-28 |
| sot822-1_fr | Footprint for reflow soldering SOT822-1 | Reflow soldering | 2009-10-08 | |
| sot822-1_po | plastic, heatsink small outline package; 16 leads | Outline drawing | 2007-02-07 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLM6G22-30G | 9340 603 04118 | BLM6G22-30G,118 |
| BLM6G22-30G | 9340 603 04135 | BLM6G22-30G,135 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| BLM6G22-30 ADS-2009 Model | Simulation model | 2013-02-28 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLM6G22-30(G) (Data sheet) | Design support | 2012-02-24 |
- W-CDMA 2100 MHz to 2200 MHz power MMIC BLM6G22_30_G
- W-CDMA 2100 MHz to 2200 MHz power MMIC BLM6G22_30_G
- W-CDMA 2100 MHz to 2200 MHz power MMIC BLM6G22_30_G
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- Footprint for reflow soldering SOT822-1 BLM6G22_30_G
- plastic, heatsink small outline package; 16 leads BLM6G22_30_G
- BLM6G22-30 ADS-2009 Model BLM6G22_30_G
- PCB Design BLM6G22-30(G) (Data sheet) BLM6G22_30_G
