BLP8G20S-80P：LDMOS功率晶体管
80 W LDMOS晶体管，适合1800 MHz至2200 MHz频率范围内的基站应用。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 1800 | 2200 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 80 | W | |||
| Gp | power gain | PL(AV) = 10 W; VDS = 28 V | 16.5 | 17.5 | dB | |
| RLin | input return loss | PL(AV) = 10 W; VDS = 28 V; IDq = 300 mA | -10 | -7 | dB | |
| ηD | drain efficiency | PL(AV) = 10 W; VDS = 28 V; 1880 MHz < f < 1920 MHz; IDq = 300 mA | 29 | 33 | % | |
| ACPR | adjacent channel power ratio | PL(AV) = 10 W; VDS = 28 V; 1880 MHz < f < 1920 MHz; IDq = 300 mA | -32 | -28 | dBc |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLP8G20S-80P |  HSOP4F (SOT1223-1) | sot1223-1_po | Reel 13" Q1/T1 in Drypack | 量产 | Standard Marking | BLP8G20S-80PY( 9340 686 65518 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | G2 | gate 2 |  |  |
| 2 | G1 | gate 1 | ||
| 3 | D1 | drain 1 | ||
| 4 | D2 | drain 2 | ||
| 5 | SOURCE | source |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLP8G20S-80P | BLP8G20S-80PY |   | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLP8G20S-80P (中文) | Power LDMOS transistor | Data sheet | 2014-10-13 | |
| AN11183 | Mounting and soldering of RF transistors in over-molded plastic packages | Application note | 2012-11-06 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLP8G20S-80P_Data-sheet | PCB Design BLP8G20S-80P (Data sheet) | Design support | zip | 2014-10-02 |
| 75017604 | Gen8: the latest LDMOS RF power portfolio for wireless infrastructures | Leaflet | 2014-09-04 | |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| sot1223-1_po | plastic, heatsink small outline package; 4 leads(flat) | Outline drawing | 2012-05-03 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLP8G20S-80P | 9340 686 65518 | BLP8G20S-80PY |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLP8G20S-80P (Data sheet) | Design support | 2014-10-02 |
- Power LDMOS transistor BLP8G20S-80P
- Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
- Enabling the Mobile Experience rf
- Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- plastic, heatsink small outline package; 4 leads(flat) BLP8G20S-80P
- PCB Design BLP8G20S-80P (Data sheet) BLP8G20S-80P
