MD7IC2050N: 1880-2025 MHz, 10 W Avg., 28 V RF LDMOS Wideband Integrated Power Amplifiers
TO-272 WB-14, TO-270 WB-14, TO-270 WB-14 Gull Package Image
特性
- 100% PAR Tested for Guaranteed Output Power Capability
- Production Tested in a Symmetrical Doherty Configuration
- Characterized with Series Equivalent Large–Signal Impedance Parameters and Common Source S-Parameters
- On-Chip Matching (50 Ohm Input, DC Blocked)
- Integrated Quiescent Current Temperature Compensation with Enable/Disable Function
- Integrated ESD Protection
- 225°C Capable Plastic Package
- RoHS Compliant
- In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13-inch Reel.
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| MD7IC2050NR1, MD7IC2050GNR1, MD7IC2050NBR1 1880-2100 MHz, 10 W Avg., 28 V Single W-CDMA RF LDMOS Wideband Integrated... (REV 1) PDF (433.3 kB) MD7IC2050N | 17 May 2010 |
Application Notes (6)
| Name/Description | Modified Date |
|---|---|
| AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 | 29 Apr 2014 |
| AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages (REV 3) PDF (910.7 kB) AN1907 | 13 May 2009 |
| Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages (REV 0) PDF (413.2 kB) AN3789 | 12 Mar 2009 |
| Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages (REV 0) PDF (8.2 MB) AN3263 | 07 Jun 2006 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 (REV 1) PDF (111.6 kB) AN1987 | 12 May 2004 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 (REV 0) PDF (112.8 kB) AN1977 | 09 Oct 2003 |
Engineering Bulletins (1)
| Name/Description | Modified Date |
|---|---|
| Using Data Sheet Impedances for RF LDMOS Devices (REV 0) PDF (171.0 kB) EB212 | 19 Jan 2004 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 | 26 May 2016 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins (REV B) PDF (72.7 kB) 98ASA10650D | 18 Mar 2016 |
| 98ASA10649D, TO, 23.65x9.25x2.59, Pitch 9.02, 14 Pins (REV B) PDF (71.4 kB) 98ASA10649D | 26 Feb 2016 |
| 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins (REV B) PDF (77.4 kB) 98ASA10653D | 26 Feb 2016 |
Ordering Information
| Product | Status | Frequency Min (Min) (MHz) | Frequency Max (Max) (MHz) | Supply Voltage (Typ) (V) | P1dB (Typ) (dBm) | P1dB (Typ) (W) | Output Power (Typ) (W) @ Intermodulation Level at Test Signal | Test Signal | Power Gain (Typ) (dB) @ f (MHz) | Efficiency (Typ) (%) | Thermal Resistance (Spec)(°C/W) | Matching | Class | Die Technology |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MD7IC2050NR1 | Active | 1880 | 2025 | 28 | 47.8 | 60 | 10 @ AVG | W-CDMA | 30.5 @ 2025 | 34.7 | 1.9 | I/O | AB, C | LDMOS |
| MD7IC2050GNR1 | Active | 1880 | 2025 | 28 | 47.8 | 60 | 10 @ AVG | W-CDMA | 30.5 @ 2025 | 34.7 | 1.9 | I/O | AB, C | LDMOS |
| MD7IC2050NBR1 | No Longer Manufactured | 1880 | 2025 | 28 | 47.8 | 60 | 10 @ AVG | W-CDMA | 30.5 @ 2025 | 34.7 | 1.9 | I/O | AB, C | LDMOS |
Package Information
| Package Description | Outline Version | Packing | Product Status | Part Number | Chemical Content | RoHS / Pb FreeChina RoHS Lookup | MSL | PPT (°C) |
|---|---|---|---|---|---|---|---|---|
| TO-270 WB-14 GULL | 98ASA10653D | MPQ - 500 REELPOQ - 500 REEL | Active | MD7IC2050GNR1 | MD7IC2050GNR1.pdf |  | 3 | 260 |
| TO-270 WB-14 LEAD | 98ASA10650D | MPQ - 500 REELPOQ - 500 REEL | Active | MD7IC2050NR1 | MD7IC2050NR1.pdf | | 3 | 260 |
| TO-272 WB-14 LEAD | 98ASA10649D | MPQ - 500 REELPOQ - 500 REEL | No Longer Manufactured | MD7IC2050NBR1 | MD7IC2050NBR1.pdf | | 3 | 260 |
- AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
- AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages mrf1570n
- Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages mrf1570n
- Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages mrf1570n
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 MMRF2010N
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 MMRF2010N
- Using Data Sheet Impedances for RF LDMOS Devices mrf1570n
- RF Products Selector Guide MMT20303H
- 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins MMRF2010N
- MD7IC2050GNR1.pdf MD7IC2050N
- 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins MMRF2010N
- MD7IC2050NR1.pdf MD7IC2050N
- 98ASA10649D, TO, 23.65x9.25x2.59, Pitch 9.02, 14 Pins MD7IC2250N
- MD7IC2050NBR1.pdf MD7IC2050N
