MHE1003N: 2450 MHz, 220 W CW, 26 V RF LDMOS Transistor for Consumer and Commercial Cooking

OM-780-2L Package Image
特性
  • Characterized with series equivalent large-signal impedance parameters and common source S-parameters
  • Internally pre-matched for ease of use
  • Qualified for operation at 28 Vdc
  • Integrated ESD protection
  • 150°C case operating temperature
  • 225°C die temperature capability
  • RoHS Compliant
特性
  • Consumer cooking
  • Commercial cooking
Data Sheets (1)
Name/DescriptionModified Date
MHE1003N 220 W CW, 2450 MHz, 26 V Data Sheet (REV 0) PDF (375.9 kB) MHE1003N22 Jul 2016
Application Notes (2)
Name/DescriptionModified Date
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN195529 Apr 2014
AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages (REV 3) PDF (910.7 kB) AN190713 May 2009
Engineering Bulletins (1)
Name/DescriptionModified Date
Using Data Sheet Impedances for RF LDMOS Devices (REV 0) PDF (171.0 kB) EB21219 Jan 2004
Selector Guides (1)
Name/DescriptionModified Date
RF Products Selector Guide (REV 43) PDF (3.8 MB) SG4626 May 2016
Package Information (1)
Name/DescriptionModified Date
98ASA10831D, OMNI, 20.57x9.78x3.81, Pitch 9.96, 2 Pins (REV C) PDF (68.6 kB) 98ASA10831D22 Mar 2016
Printed Circuit Boards
Ordering Information
ProductStatusFrequency Min (Min) (MHz)Frequency Max (Max) (MHz)Supply Voltage (Typ) (V)P1dB (Typ) (dBm)P1dB (Typ) (W)Output Power (Typ) (W) @ Intermodulation Level at Test SignalTest SignalPower Gain (Typ) (dB) @ f (MHz)Efficiency (Typ) (%)Thermal Resistance (Spec)(°C/W)MatchingClassDie Technology
MHE1003NR3Active245024502653.1206220 @ CWCW14.1 @ 245063.50.24I/OABLDMOS
Package Information
Package DescriptionOutline VersionPackingProduct StatusPart NumberChemical ContentRoHS / Pb FreeChina RoHS LookupMSLPPT (°C)
OM780-2 Straight Cu98ASA10831DMPQ - 250 REELPOQ - 250 REELActiveMHE1003NR3MHE1003NR3.pdf3260
MHE1003N 220 W CW, 2450 MHz, 26 V Data Sheet MHE1003N
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages mrf1570n
Using Data Sheet Impedances for RF LDMOS Devices mrf1570n
RF Products Selector Guide MMT20303H
MHE1003N 2450 MHz PCB Device Reference Circuit DXF file MHE1003N
98ASA10831D, OMNI, 20.57x9.78x3.81, Pitch 9.96, 2 Pins MMRF1017N
MHE1003NR3.pdf MHE1003N