NX2020P1: 30 V, single P-channel Trench MOSFET

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

sot1220_3d
Data Sheets (1)
Name/DescriptionModified Date
30 V, single P-channel Trench MOSFET (REV 2.0) PDF (267.0 kB) NX2020P1 [English]26 Feb 2014
Application Notes (6)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
Selector Guides (2)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Package Information (1)
Name/DescriptionModified Date
DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals (REV 1.0) PDF (212.0 kB) SOT1220 [English]08 Feb 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
NX2020P1 NXP Product Quality (REV 1.2) PDF (74.0 kB) NX2020P1_NXP_PRODUCT_QUALITY [English]31 Jan 2015
NX2020P1 NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX2020P1_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English]31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
30 V, single P-channel Trench MOSFET NX2020P1
LFPAK MOSFET thermal design guide BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
Using RC Thermal Models BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using power MOSFETs in parallel BUK7M12-60E
NX2020P1 NXP Product Quality NX2020P1
NX2020P1 NXP Product Reliability NX2020P1
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals PMPB95ENEA
Footprint for reflow soldering SOT1220 PMPB95ENEA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20