NX7002BKM: 60 V, N-channel Trench MOSFET

N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1006-3 (SOT883) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT883
Data Sheets (1)
Name/DescriptionModified Date
60 V, N-channel Trench MOSFET (REV 2.0) PDF (237.0 kB) NX7002BKM [English]03 Dec 2014
Application Notes (6)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
Selector Guides (2)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Package Information (1)
Name/DescriptionModified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
Packing (1)
Name/DescriptionModified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
NX7002BKM NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX7002BKM_1 [English]31 Jan 2015
NX7002BKM NXP Product Quality (REV 1.2) PDF (74.0 kB) NX7002BKM_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English]31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] (nC)Ptot [max] (W)QG(tot) [typ] @ VGS = 10 V (nC)VGSth [typ] (V)Qr [typ] (nC)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
NX7002BKMActiveSOT883DFN1006-3N160280032001500.350.1810.3511.61N23.64.62014-10-02
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
NX7002BKMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveNX7002BKMYL (9340 686 17315)WZNX7002BKMAlways Pb-free234.01.089.26E811
60 V, N-channel Trench MOSFET NX7002BKM
Using power MOSFETs in parallel BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
NX7002BKM NXP® Product Reliability NX7002BKM
NX7002BKM NXP Product Quality NX7002BKM
Power MOSFET frequently asked questions and answers BUK7M12-60E
NX7002BKM Spice model NX7002BKM
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PMZ950UPE