PMDPB58UPE: 20 V dual P-channel Trench MOSFET

Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

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Data Sheets (1)
Name/DescriptionModified Date
20 V dual P-channel Trench MOSFET (REV 4.0) PDF (223.0 kB) PMDPB58UPE [English]03 Feb 2016
Application Notes (11)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English]10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English]04 Feb 2014
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English]08 Nov 2013
MOSFET load switch PCB with thermal measurement (REV 1.0) PDF (881.0 kB) AN11304 [English]28 Jan 2013
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English]29 Oct 2012
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
Brochures (2)
Name/DescriptionModified Date
适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English]28 Oct 2013
Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English]04 Sep 2013
Selector Guides (3)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Advanced cross reference list DFN* MOSFETs (REV 1.1) PDF (248.0 kB) 75017313 [English]19 Jun 2012
Package Information (1)
Name/DescriptionModified Date
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (198.0 kB) SOT1118 [English]08 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2020-6; reel pack; standard orientation; 12NC ending 115 (REV 1.0) PDF (196.0 kB) SOT1118_115 [English]07 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PMDPB58UPE NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMDPB58UPE_1 [English]31 Jan 2015
PMDPB58UPE NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMDPB58UPE_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English]31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameChannel typeNumber of transistorsRDSon [max] @ VGS = 10 V (mΩ)VDS [max] (V)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)Ptot [max] (W)QG(tot) [typ] @ VGS = 10 V (nC)VGSth [typ] (V)Qr [typ] (nC)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PMDPB58UPEActiveSOT1118DFN2020-6P2-206795150-4.50.96.36.30.515-0.7N804952012-06-20
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PMDPB58UPESOT1118Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMDPB58UPE,115 (9340 668 45115)2APMDPB58UPEAlways Pb-free234.01.089.26E811
20 V dual P-channel Trench MOSFET PMDPB58UPE
Using power MOSFETs in parallel BUK7M12-60E
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
MOSFET load switch PCB with thermal measurement pmpb40sna
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
适用于便携设备和移动电话... ptvsxs1ur_automotive
Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
Advanced cross reference list DFN* MOSFETs PMZB370UNE
PMDPB58UPE NXP® Product Reliability PMDPB58UPE
PMDPB58UPE NXP® Product Quality PMDPB58UPE
Power MOSFET frequently asked questions and answers BUK7M12-60E
PMDPB58UPE Spice model PMDPB58UPE
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm PBSS5260PAP
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-6; reel pack; standard orientation; 12NC ending 115 PBSS5260PAP
PMFPB8040XP