PMEG3010BEV: Very low VF MEGA Schottky barrier rectifiers
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a very small SOD323 (SC-76) and ultra small SOT666 SMD plastic package.
PMEG3010BEV: Product Block Diagram
PMEG3010BEV: Block Diagram
PMEG3010BEV: Block Diagram
SOT666
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 1 A very low VF MEGA Schottky barrier rectifier in ultra small SOT666 and in very small SOD323 (SC-76) package (REV 4.0) PDF (158.0 kB) PMEGXX10BEA_PMEGXX10BEV | 14 Jun 2004 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 | 29 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG3010BEV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010BEV | 31 Jan 2015 |
| PMEG3010BEV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010BEV_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG3010BEV SPICE model (REV 1.4) prm PMEG3010BEV_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3010BEV | Active | SOT666 | SOT666 | 1.6 x 1.2 x 0.55 | 1 | 30 | single | 0,15@VR=30V | 10 | 70@VR=1V | 560@IF=1A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3010BEV | | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3010BEV,115 (9340 583 29115) | G5 | PMEG3010BEV |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG3010BEV NXP® Product Reliability PMEG3010BEV
- PMEG3010BEV NXP® Product Quality PMEG3010BEV
- PMEG3010BEV SPICE model PMEGXX10BEA_PMEGXX10BEV
- plastic surface-mounted package; 6 leads BSS84AKV
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
- PMEGXX10BEA_PMEGXX10BEV
- PMEGXX10BEA_PMEGXX10BEV
- 1PSXSB17
