PMXB350UPE: 20 V, P-channel Trench MOSFET

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

sot1215_3d
Data Sheets (1)
Name/DescriptionModified Date
20 V, P-channel Trench MOSFET (REV 2.0) PDF (240.0 kB) PMXB350UPE [English]24 Jan 2014
Application Notes (7)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English]10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
Brochures (1)
Name/DescriptionModified Date
NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful (REV 1.0) PDF (1.8 MB) 75017485 [English]04 Nov 2013
Selector Guides (2)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Package Information (1)
Name/DescriptionModified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]08 Feb 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
PMXB350UPE NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMXB350UPE_1 [English]31 Jan 2015
PMXB350UPE NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMXB350UPE_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English]31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage namePackage versionChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)Ptot [max] (W)QG(tot) [typ] @ VGS = 10 V (nC)VGSth [typ] (V)Qr [typ] (nC)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PMXB350UPEActiveDFN1010D-3SOT1215P1-20447645150-1.20.281.251.250.36-0.7N11616.52013-09-19
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PMXB350UPESOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActivePMXB350UPEZ (9340 671 52147)11 10 00PMXB350UPEAlways Pb-free234.01.089.26E811
Reel 7" Q1/T1WithdrawnPMXB350UPEX (9340 671 52115)11 10 00PMXB350UPEAlways Pb-free234.01.089.26E811
20 V, P-channel Trench MOSFET PMXB350UPE
Using power MOSFETs in parallel BUK7M12-60E
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful PBSS5260QA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
PMXB350UPE NXP® Product Reliability PMXB350UPE
PMXB350UPE NXP® Product Quality PMXB350UPE
Power MOSFET frequently asked questions and answers BUK7M12-60E
PMXB350UPE Spice model PMXB350UPE
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE