PMZ270XN: N-channel TrenchMOS® extremely low level FET
Extremely low level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS® technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| N-channel TrenchMOS® extremely low level FET (REV 1.0) PDF (111.0 kB) PMZ270XN [English] | 21 Feb 2008 |
Application Notes (10)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
Selector Guides (3)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
| Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288 [English] | 23 Aug 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMZ270XN NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMZ270XN_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PMZ270XN NXP® Product Reliability (REV 1.0) PDF (88.0 kB) PMZ270XN_NXP_PRODUCT_RELIABILITY [English] | 16 Jul 2014 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English] | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PMZ270XN_4_4_2011 Spice parameter (REV 1.0) lib PMZ270XN_4_4_2011 8/22/2011
Ordering Information
| Product | Status | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMZ270XN | End of Life | DFN1006-3 | N | 1 | 20 | 340 | 150 | 0.18 | 0.72 | 0.72 | 2.5 | 1 | N | 34 | 12 | 2011-01-24 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMZ270XN | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Discontinued | PMZ270XN,315 (9340 601 55315) | Z4 | PMZ270XN |    | Always Pb-free | 1 | 1 |
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- PMZ270XN NXP Product Quality PMZ270XN
- PMZ270XN_4_4_2011 Spice parameter PMZ270XN
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- leadless ultra small plastic package; 3 solder lands PMZ950UPE
- Footprint for reflow soldering SOT883 PMZ950UPE
