PSMN3R5-25MLD: N-channel 25 V, 3.72 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETS with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.
sot1210_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| N-channel 25 V, 3.72 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology (REV 1.0) PDF (292.0 kB) PSMN3R5-25MLD [English] | 07 Apr 2016 |
Application Notes (9)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| Using Power MOSFET Zth Curves (REV 1.0) PDF (212.0 kB) AN11156 [English] | 10 Oct 2012 |
| Designing RC Snubbers (REV 1.0) PDF (565.0 kB) AN11160 [English] | 01 Oct 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Ultra-reliable LFPAK56 and LFPAK33 (REV 1.0) PDF (4.4 MB) 75017659 [English] | 18 May 2015 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| Plastic single ended surface mounted package (LFPAK33); 8 leads (REV 1.1) PDF (255.0 kB) SOT1210 [English] | 18 Oct 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| LFPAK33; Reel pack, SMD, 7' Q1/T1 Standard product orientation Orderable part number ending, 115 or... (REV 1.0) PDF (222.0 kB) SOT1210_115 [English] | 31 Mar 2014 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English] | 31 Oct 2016 |
SPICE model
- PSMN3R5-25MLD SPICE model (REV 1.0) lib PSMN3R5-25MLD_1 4/8/2016
Thermal design
- PSMN3R5-25MLD Thermal design model (REV 1.0) PDF PSMN3R5-25MLD_RC_THERMAL_MODEL 4/8/2016
Thermal model
- PSMN3R5-25MLD Thermal model (REV 1.0) pdml PSMN3R5-25MLD_1_2 4/8/2016
Ordering Information
| Product | Status | Package name | Package version | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN3R5-25MLD | Active | LFPAK33 | SOT1210 | N | 1 | 25 | 3.72 | 5.41 | 175 | 70 | 2.1 | 8.7 | 18.9 | 18.9 | 65 | 13.5 | 1.73 | N | 1334 | 863 | 2016-03-22 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN3R5-25MLD | | SOT1210 | Reel 7" Q1/T1 | Active | PSMN3R5-25MLDX (9340 699 16115) | 3D525L | PSMN3R5-25MLD |   | 1 | 1 |
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Using RC Thermal Models BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Using Power MOSFET Zth Curves BUK7M12-60E
- Designing RC Snubbers BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Ultra-reliable LFPAK56 and LFPAK33 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- PSMN3R5-25MLD SPICE model PSMN3R5-25MLD
- PSMN3R5-25MLD Thermal design model PSMN3R5-25MLD
- PSMN3R5-25MLD Thermal model PSMN3R5-25MLD
- Plastic single ended surface mounted package (LFPAK33); 8 leads BUK7M12-60E
- LFPAK33; Reel pack, SMD, 7' Q1/T1 Standard product orientation Orderable part number ending, 115 or... BUK7M12-60E
- PSMN9R8-30MLC
