PSMN7R5-30MLD: N-channel 30 V, 7.5 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

sot1210_3d
Data Sheets (1)
Name/DescriptionModified Date
N-channel 30 V, 7.5 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology (REV 1.6) PDF (277.0 kB) PSMN7R5-30MLD [English]11 Aug 2015
Application Notes (6)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
Brochures (1)
Name/DescriptionModified Date
Ultra-reliable LFPAK56 and LFPAK33 (REV 1.0) PDF (4.4 MB) 75017659 [English]18 May 2015
Selector Guides (2)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Package Information (1)
Name/DescriptionModified Date
Plastic single ended surface mounted package (LFPAK33); 8 leads (REV 1.1) PDF (255.0 kB) SOT1210 [English]18 Oct 2016
Packing (1)
Name/DescriptionModified Date
LFPAK33; Reel pack, SMD, 7' Q1/T1 Standard product orientation Orderable part number ending, 115 or... (REV 1.0) PDF (222.0 kB) SOT1210_115 [English]31 Mar 2014
Supporting Information (1)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English]31 Oct 2016
SPICE model
Thermal model
Ordering Information
ProductStatusPackage versionPackage nameChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)QGD [typ] (nC)Tj [max] (°C)QG(tot) [typ] (nC)ID [max] (A)Qr [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)Ptot [max] (W)VGSth [typ] (V)QG(tot) [typ] @ VGS = 10 V (nC)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PSMN7R5-30MLDActiveSOT1210LFPAK33N1307.610.31.71755.857115.8451.711.3N6555782013-10-02
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFMSLMSL LF
PSMN7R5-30MLDSOT1210Reel 7" Q1/T1ActivePSMN7R5-30MLDX (9340 679 72115)7D530LPSMN7R5-30MLD11
N-channel 30 V, 7.5 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology PSMN7R5-30MLD
Using power MOSFETs in parallel BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
Ultra-reliable LFPAK56 and LFPAK33 BUK7M12-60E
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
Power MOSFET frequently asked questions and answers BUK7M12-60E
PSMN7R5-30MLD Spice model PSMN7R5-30MLD
PSMN7R5-30MLD Thermal model PSMN7R5-30MLD
Plastic single ended surface mounted package (LFPAK33); 8 leads BUK7M12-60E
LFPAK33; Reel pack, SMD, 7' Q1/T1 Standard product orientation Orderable part number ending, 115 or... BUK7M12-60E
PSMN9R8-30MLC