PUSB2X4Y: ESD protection for high-speed interfaces
The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to ±12 kV contact according to IEC 61000-4-2, level 4.
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| ESD protection for high-speed interfaces (REV 1.1) PDF (486.0 kB) PUSB2X4Y [English] | 05 Nov 2013 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 [English] | 03 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
Reliability and Quality Information (1)
| Name/Description | Modified Date |
|---|---|
| PUSB2X4Y NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUSB2X4Y_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) | Recommended for |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PUSB2X4Y | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 4 | Rail-to-Rail | 0.55 | 0.75 | 5.5 | 12 | 1 | USB2.0 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PUSB2X4Y | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | PUSB2X4YH (9340 679 37125) | PK% | PUSB2X4Y |    | Always Pb-free | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- PUSB2X4Y NXP® Product Quality PUSB2X4Y
- MAR_SOT363 Topmark BSS84AKS
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- BFU520Y
