HA1631D03MM
| HA1631D03MM.pdf |
Pin Assignment |
Dimensions |
| Star Product | - |
|---|---|
| Process | CMOS |
| Ch. | Dual |
| Single Supply (V) min. | 1.8 |
| Single Supply (V) max. | 5.5 |
| Input Offset Voltage Vio (±mV) max. | 5 |
| Supply Current Icc/Idd (mA) max. | 0.005 |
| Response Time TPHL (μs) typ. | 0.55 |
| Operating Temperature Topr (°C) min. | -40 |
| Operating Temperature Topr (°C) max. | 85 |
| Output Current Io Sink (mA) typ. | 14 |
| Package Type | MMPAK |
| Production Status | Non-promotion |
| Name | LSOP |
|---|---|
| JEITA code | - |
| Previous code | - |
| Renesas code | PLSP0008JC-A |
| Terminal count | 8 |
| Terminal pitch (mm) | 0.65 mm |
| Mass (g) [TYP,] | 0.02 |
| Drawing Link | plsp0008jc_a |
| Packing | Embossed Tape |
| Terminal material - Base | Cu alloy |
| Terminal material - Surface | Sn-Bi |
| Part Number | Production Status | Product Longevity Program (PLP) | 1000 Piece Budgetary Price | Remarks | Star Produc | RoHS |
|---|---|---|---|---|---|---|
| HA1631D03MMEL-E | Non-promotion | Mar, 2030 | | MOQ:3000| WRAP_SPEC:Embossed Tape| OTHER_ENV: | false | RoHS |
