BALF-2690-02D3:50Ω nominal input / conjugate match balun to STLC2690, with integrated harmonic filter

STMicroelectronics BALF-2690-02D3 is a balun design to transform single ended signal to differential signals in Bluetooth applications. This BALF-2690-02D3 has been customized for STLC2690 Bluetooth transceiver with less than 1.2 dB insertion losses in the bandwidth (2400 MHz-2500 MHz).

The BALF-2690-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate which optimize RF performance.

Key Features

  • 50 Ω nominal input / matched output differential impedance
  • Integrated harmonic filter
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Small footprint < 1.54 mm²
Product Specifications
DescriptionVersionSize
DS9922: 50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter4.0508 KB
Application Notes
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.0942 KB
Brochures
DescriptionVersionSize
Products and Solutions for Factory Automation and Control1.03 MB
Semiconductor solutions for healthcare applications1.0665 KB
Sample & Buy
Part NumberPackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BALF-2690-02D3Chip Scale Package 0.4mm pitchTape And Reel50000.144100NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
BALF-2690-02D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bl2690b_vers2_sdm_signed.pdf
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bl2690b_vers2.xml
50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter BALF-2690-02D3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bl2690b_vers2_sdm_signed.pdf BALF-2690-02D3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bl2690b_vers2.xml BALF-2690-02D3