BALF-NRF01E3:50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and nRF51422-QFABAx with integrated filter

STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.

It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

Key Features

  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated CSP on glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
Product Specifications
DescriptionVersionSize
DS10702: 50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter3.0578 KB
Application Notes
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.0942 KB
Brochures
DescriptionVersionSize
Products and Solutions for Factory Automation and Control1.03 MB
Semiconductor solutions for healthcare applications1.0665 KB
Sample & Buy
Part NumberPackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BALF-NRF01E3FLIP CHIP BUMPLESS CSPGTape And Reel50000.132100NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
BALF-NRF01E3FLIP CHIP BUMPLESS CSPGIndustrialEcopack2md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.pdf
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.xml
50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter BALF-NRF01E3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.pdf BALF-NRF01E3
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.xml BALF-NRF01E3