EMIF06-HSD03F3:6-line EMI filter with integrated ESD protection for micro-SD Card™

The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.

Key Features

  • Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
  • High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
  • Very low PCB space consumption:
    • 1.1 x 2.4 mm
  • Ultralow leakage current: 20 nA max.
  • Very thin package: 0.605 mm
  • Smart pinout for easier PCB layout
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free package
  • Complies with the following standards:
    • IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
Product Specifications
DescriptionVersionSize
DS9928: EMI filter with integrated ESD protection for micro-SD Card™4.0560 KB
Application Notes
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF06-HSD03F3 S-parameter model (.sxp)1.0535 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-HSD03F3Flip-Chip 400uTape And Reel0.2071000NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-HSD03F3Flip-Chip 400uIndustrialEcopack2md_h1-wspc-wlcsp0.4-rdl4-49_kah1-wspc-em6hsda.pdf
md_h1-wspc-wlcsp0.xml
EMI filter with integrated ESD protection for micro-SD Card™ EMIF06-HSD03F3
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF06-HSD03F3
md_h1-wspc-wlcsp0.4-rdl4-49_kah1-wspc-em6hsda.pdf EMIF06-HSD03F3
md_h1-wspc-wlcsp0.xml EMIF06-HSD03F3