The LPS225HB is an ultra-compact piezoresistive absolute pressure sensor. It includes a monolithic sensing element and an IC interface which communicates a digital signal from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane inside a single mono-silicon substrate and is manufactured using a dedicated process developed by ST.
The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.
The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LPS225HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
Key Features
| Description | Version | Size |
|---|---|---|
| DS11950: MEMS pressure sensor: 26 - 126 kPa absolute digital output barometer | 1.0 | 1 MB |
| Description | Version | Size |
|---|---|---|
| TN1198: Surface mount guidelines for MEMS sensors in HLGA packages | 1.0 | 128 KB |
| Part Number | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| LPS225HBTR | HLGA 2.5X2X0.8 8LD EXPOSED CHIP | Tape And Reel | - | - | NEC | EAR99 | - |
| LPS225HB | HLGA 2.5X2X0.8 8LD EXPOSED CHIP | Tray | - | - | NEC | EAR99 | - |
| Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LPS225HBTR | HLGA 2.5X2X0.8 8LD EXPOSED CHIP | Industrial | Ecopack2 | |
| LPS225HB | HLGA 2.5X2X0.8 8LD EXPOSED CHIP | Industrial | Ecopack2 |
