LSM303AGR:Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer

The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.

The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.

The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.

The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.

The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Key Features

  • 3 magnetic field channels and 3 acceleration channels
  • ±50 gauss magnetic dynamic range
  • ±2/±4/±8/±16 g selectable acceleration full scales
  • 16-bit data output
  • SPI / I2 C serial interfaces
  • Analog supply voltage 1.71 V to 3.6 V
  • Selectable power mode/resolution for accelerometer and magnetometer
  • Single measurement mode for magnetometer
  • Programmable interrupt generators for free-fall, motion detection and magnetic field detection
  • Embedded self-test
  • Embedded temperature sensor
  • Embedded FIFO
  • ECOPACK® , RoHS and “Green” compliant
Product Specifications
DescriptionVersionSize
DS10999: Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer9.01 MB
Application Notes
DescriptionVersionSize
AN4825: Ultra-compact high-performance eCompass module based on the LSM303AGR1.01 MB
Technical Notes & Articles
DescriptionVersionSize
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package5.0218 KB
Design Notes & Tips
DescriptionVersionSize
DT0058: Computing tilt measurement and tilt-compensated e-compass1.0220 KB
DT0059: Ellipsoid or sphere fitting for sensor calibration2.0409 KB
DT0060: Exploiting the gyroscope to update tilt measure and e-compass1.0226 KB
Brochures
DescriptionVersionSize
MEMS and Sensors, Smart solutions for IoT and enhanced user experience1 MB
STM32 Open Development Environment
Part NumberManufacturerDescription
X-NUCLEO-IKS01A2STMotion MEMS and environmental sensor expansion board for STM32 Nucleo
Product Evaluation Tools
Part NumberManufacturerDescription
STEVAL-MKI172V1STLSM303AGR adapter board for a standard DIL 24 socket
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
LSM303AGRTRLGA 2X2X1 12LD PITCH 0.5MMTape And Reel1.4851000NECEAR99-
LSM303AGRLGA 2X2X1 12LD PITCH 0.5MMTray-1000NECEAR99-
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
LSM303AGRTRLGA 2X2X1 12LD PITCH 0.5MMIndustrialEcopack2
LSM303AGRLGA 2X2X1 12LD PITCH 0.5MMIndustrialEcopack2
Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer LSM303AGR
Ultra-compact high-performance eCompass module based on the LSM303AGR LSM303AGR
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Computing tilt measurement and tilt-compensated e-compass LSM303DLHC
Ellipsoid or sphere fitting for sensor calibration LSM303DLHC
Exploiting the gyroscope to update tilt measure and e-compass LSM303DLHC
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D