• 简体中文
• English

RPC564A80B4：32-bit Power Architecture MCU for Aerospace & Defense Applications

The microcontroller’s e200z4 host processor core is built on Power Architecture technology and designed specifically for embedded applications. In addition to the Power Architecture technology, this core supports instructions for digital signal processing (DSP).

The RPC564A80 has two levels of memory hierarchy consisting of 8 KB of instruction cache, backed by 192 KB on-chip SRAM and 4 MB of internal flash memory. The RPC564A80 includes an external bus interface, and also a calibration bus that is only accessible when using the calibration tools.

This document describes the features of the RPC564A80 and highlights important electrical and physical characteristics of the device.

Key Features

• 150 MHz e200z4 Power Architecture® core
  • Variable length instruction encoding (VLE)
  • Superscalar architecture with 2 execution units
  • Up to 2 integer or floating point instructions per cycle
  • Up to 4 multiply and accumulate operations per cycle
• Memory organization
  • 4 MB on-chip flash memory with ECC and Read While Write (RWW)
  • 192 KB on-chip RAM with standby functionality (32 KB) and ECC
  • 8 KB instruction cache (with line locking), configurable as 2- or 4-way
  • 14 + 3 KB eTPU code and data RAM
  • 5 × 4 crossbar switch (XBAR)
  • 24-entry MMU
  • External Bus Interface (EBI) with slave and master port
• Fail Safe Protection
  • 16-entry Memory Protection Unit (MPU)
  • CRC unit with 3 sub-modules
  • Junction temperature sensor
• Interrupts
  • Configurable interrupt controller (with NMI)
  • 64-channel DMA
• Serial channels
  • 3 × eSCI
  • 3 × DSPI (2 of which support downstream Micro Second Channel [MSC])
  • 3 × FlexCAN with 64 messages each
  • 1 × FlexRay module (V2.1) up to 10 Mbit/s with dual or single channel and 128 message objects and ECC
• 1 × eMIOS
• 1 × eTPU2 (second generation eTPU)
• 2 enhanced queued analog-to-digital converters (eQADCs)
• On-chip CAN/SCI/FlexRay Bootstrap loader with Boot Assist Module (BAM)
• Nexus: Class 3+ for core; Class 1 for the eTPU
• JTAG (5-pin)
• Development Trigger Semaphore (DTS)
• Clock generation
  • On-chip 4–40 MHz main oscillator
  • On-chip FMPLL (frequency-modulated phase-locked loop)
• Up to 120 general purpose I/O lines
• Power reduction mode: slow, stop and stand-by modes
• Flexible supply scheme
  • 5 V single supply with external ballast
  • Multiple external supply: 5 V, 3.3 V and 1.2 V
• Designed for LQFP176, LBGA208, PBGA324 and Known Good Die (KGD)
• Aerospace and Defense features
  • Dedicated traceability and part marking
  • Production parts approval documents available
  • Adapted Extended life time and obsolescence management
  • Extended Product Change Notification process
  • Designed and manufactured to meet sub ppm quality goals
  • Advanced mold and frame designs for Superior resilience to harsh environment (acceleration, EMI, thermal, humidity)
  • Single Fabrication, Assembly and Test site
  • Dual internal production source capability

Product Specifications

Presentations

Software Development Tools

Product Evaluation Tools

Sample & Buy

Quality & Reliability