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RPC56AP60L3：32-bit Power Architecture MCU for Aerospace & Defense Applications

This 32-bit system-on-chip (SoC) microcontroller family is the latest achievement in integrated application controllers.

This family is one of a series of next-generation integrated microcontrollers based on the Power Architecture technology.

The advanced and cost-efficient host processor core of this controller family complies with the Power Architecture embedded category. It operates up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

Key Features

• 64 MHz, single issue, 32-bit CPU core complex (e200z0h)
  • Compliant with Power Architecture® embedded category
  • Variable Length Encoding (VLE)
• Memory organizazion
  • Up to 1024 KB on-chip code Flash memory with additional 64 KB for EEPROM emulation (data flash), with ECC, with erase/program controller
  • Up to 80 KB on-chip SRAM with ECC
• Fail safe protection
  • ECC protection on system SRAM and Flash
  • Safety port
  • SWT with servicing sequence pseudo-random generator
  • Power management
  • Non-maskable interrupt for both cores
  • Fault collection and control unit (FCCU)
  • Safe mode of system-on-chip (SoC)
  • Register protection scheme
• Nexus® L2+ interface
• Single 3.3 V or 5 V supply for I/Os and ADC
• 2 on-platform peripherals set with 2 INTC
• 16-channel eDMA controller with multiple transfer request sources
• General purpose I/Os
• 2 general purpose eTimer units
  • 6 timers, each with up/down count capabilities
  • 16-bit resolution, cascadable counters
  • Quadrature decode with rotation direction flag
  • Double buffer input capture and output compare
• Communications interfaces
  • 2 LINFlex modules (LIN 2.1, 1 × Master/Slave, 1 × Master Only)
  • 5 DSPI modules with automatic chip select generation
  • 2 FlexCAN interfaces (2.0B Active) with 32 message buffers
  • 1 Safety port based on FlexCAN; usable as third CAN when not used as safety port
  • 1 FlexRay™ module (V2.1) with dual or single channel, 64 message buffers and up to 10 Mbit/s
• 2 CRC units with three contexts and 3 hardwired polynomials
• 10-bit A/D converter
  • 27 input channels and pre-sampling feature
  • Conversion time < 1 μs including sampling time at full precision
  • Programmable cross triggering unit (CTU)
  • 4 analog watchdog with interrupt capability
• On-chip CAN/UART Bootstrap loader with boot assist module (BAM)
• Ambient temperature ranges: –40 to 125 °C
• Aerospace and Defense features
  • Dedicated traceability and part marking
  • Production parts approval documents available
  • Adapted Extended life time and obsolescence management
  • Extended Product Change Notification process
  • Designed and manufactured to meet sub ppm quality goals
  • Advanced mold and frame designs for Superior resilience to harsh environment (acceleration, EMI, thermal, humidity)
  • Single Fabrication, Assembly and Test site
  • Dual internal production source capability

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