74AXP1G57: 低功耗可配置多功能门

74AXP1G57是带施密特触发输入的可配置多功能门。该器件可配置为任何以下逻辑功能:AND、OR、NAND、NOR、XNOR、反相器和缓冲器。所有输入都可直接连接到VCC或GND。该器件可确保整个0.7 V至2.75 V VCC范围内的极低静态和动态功耗。该器件完全针对使用IOFF的局部掉电应用而设计。IOFF电路可禁用输出,防止掉电时潜在破坏性回流电流通过该器件。

sot1255_3d
数据手册 (1)
名称/描述Modified Date
Low-power configurable multiple function gate (REV 3.0) PDF (228.0 kB) 74AXP1G57 [English]16 Sep 2015
手册 (2)
名称/描述Modified Date
NXP® 74AXP1G57 Demoboard brochure (REV 1.0) PDF (972.0 kB) 75017471 [English]24 Oct 2013
AXP - the logic family for portable applications: Advanced, extremely-low voltage and power CMOS logic (REV 1.0) PDF (1.1 MB) 75017461 [English]27 Jun 2013
选型工具指南 (2)
名称/描述Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
封装信息 (4)
名称/描述Modified Date
plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.35 mm (REV 1.1) PDF (217.0 kB) SOT1255 [English]22 Apr 2016
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
X2SON6; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 3.0) PDF (202.0 kB) SOT1255_147 [English]20 Oct 2016
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态
74AXP1G57GNActive
74AXP1G57GSActive
74AXP1G57GMActive
74AXP1G57GXActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AXP1G57GNSOT1115Reel 7" Q3/T4, ReverseActive74AXP1G57GNH (9353 015 97125)RC74AXP1G57GNAlways Pb-free11
74AXP1G57GSSOT1202Reel 7" Q3/T4, ReverseActive74AXP1G57GSH (9353 015 98125)RC74AXP1G57GSAlways Pb-free11
74AXP1G57GXSOT1255Reel 7" Q2/T3Active74AXP1G57GXZ (9353 070 74147)Standard Marking74AXP1G57GXAlways Pb-free11
74AXP1G57GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AXP1G57GMH (9353 015 96125)RC74AXP1G57GMAlways Pb-free11
Low-power configurable multiple function gate 74AXP1G57GX
NXP® 74AXP1G57 Demoboard brochure 74AXP1G98GS
AXP - the logic family for portable applications: Advanced, extremely-low voltage and power CMOS logic 74AXP1G98GS
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT1115 Topmark 74AUP1G332
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT886 Topmark prtr5v0u2f
74AXP1G57 IBIS model 74AXP1G57GS
SOT1115 74AUP1G332
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
SOT1255 74AUP1G3208
Reel 7" Q2/T3 74AUP1G3208
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
74LVC2G17
74LVC2G17
BGU8007