300 W LDMOS RF功率晶体管,适用于HF至500 MHz频段广播应用以及工业、科学和医疗应用。
特性和优势
应用
| 产品图片 |
Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
---|---|---|---|---|---|---|
frange | frequency range | 10 | 500 | MHz | ||
PL(1dB) | nominal output power at 1 dB gain compression | 300 | W | |||
Gp | power gain | PL = 300 W; VDS = 50 V | 26 | 27.2 | 28.4 | dB |
RLin | input return loss | PL = 300 W; VDS = 50 V; IDq = 900 mA | -13 | -10 | dB | |
ηD | drain efficiency | PL = 300 W; VDS = 50 V; f = 225 MHz; IDq = 900 mA | 67 | 70 | % | |
PL | output power | 300 | W |
型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
---|---|---|---|---|---|---|---|
BLF573 | (SOT502A) | sot502a_po | Bulk Pack | 量产 | Standard Marking | BLF573,112( 9340 644 45112 ) |
Pin | Symbol | Description | 外形简图 | 图形符号 |
---|---|---|---|---|
1 | D | drain | ||
2 | G | gate | ||
3 | S | souce |
型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
---|---|---|---|---|---|
BLF573 | BLF573,112 | Always Pb-free | NA | NA |
档案名称 | 标题 | 类型 | 格式 | 日期 |
---|---|---|---|---|
BLF573_BLF573S (中文) | HF / VHF power LDMOS transistor | Data sheet | 2010-07-08 | |
AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
PCB_Design_BLF573_BLF573S_Data-sheet | PCB Design BLF573(S) (Data sheet) | Design support | zip | 2012-02-24 |
fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
BLF573_ADS-2009_Model | BLF573 ADS-2009 Model | Simulation model | zip | 2013-06-20 |
NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 | |
NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
sot502a_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | 2009-10-08 | |
SOT502A_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | 2012-11-30 |
型号 | 订购码 (12NC) | 可订购的器件编号 |
---|---|---|
BLF573 | 9340 644 45112 | BLF573,112 |
标题 | 类型 | 日期 |
---|---|---|
BLF573 ADS-2009 Model | Simulation model | 2013-06-20 |
RF Power Model Library for Microwave Office® | Simulation model | 2014-11-11 |
RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 |
RF Power Simulation Example for Microwave Office® | Simulation model | 2012-06-11 |
标题 | 类型 | 日期 |
---|---|---|
PCB Design BLF573(S) (Data sheet) | Design support | 2012-02-24 |