BLM7G1822S-20PB(G)：LDMOS 2级功率MMIC

BLM7G1822S-20PB(G)是双扇区2级功率MMIC，使用恩智浦最先进的GEN7 LDMOS技术。该多频段器件非常适合频率范围为1805 MHz至2170 MHz的通用驱动器或小型基站最终产品。采用鸥翼式或直引脚外形。

特性和优势
    • 设计用于宽带操作（频率范围：1805 MHz至2170 MHz）
    • 可实现多个组合的扇区间高隔离度
    • 集成式温度补偿偏置
    • 单级偏置从外部进行访问
    • 集成式ESD保护
    • 极佳的热稳定性
    • 高功率增益
    • 片上匹配，便于使用
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 适合1805 MHz至2170 MHz频率范围内W-CDMA基站的RF功率MMIC。可能的电路拓扑结构如下：
      • 双扇区或单端
      • Doherty
      • 正交组合
      • 推挽
    • 双扇区或单端
    • Doherty
    • 正交组合
    • 推挽
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLM7G1822S-20PBSOT1211-11805217020282332.31-c WCDMA; 1-c WCDMAProduction
BLM7G1822S-20PBGSOT1212-11805217020282332.31-c WCDMA; 1-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLM7G1822S-20PB
HSOP16F
(SOT1211-1)		sot1211-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-20PBY( 9340 683 55518 )
BLM7G1822S-20PBG
HSOP16
(SOT1212-1)		sot1212-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-20PBGY( 9340 683 56518 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLM7G1822S-20PBBLM7G1822S-20PBY33
BLM7G1822S-20PBGBLM7G1822S-20PBGY33
文档资料
档案名称标题类型格式日期
BLM7G1822S-20PB_S-20PBG (中文)LDMOS 2-stage power MMICData sheetpdf2015-07-01
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G1822S-20PB_S-20PBG_Data-sheetPCB Design BLM7G1822S-20PB(G) (Data sheet)Design supportzip2014-05-22
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
BLM7G1822S-20PBG_ADS-2012_ModelBLM7G1822S-20PBG ADS-2012 ModelSimulation modelzip2014-06-06
BLM7G1822S-20PB_ADS-2012_ModelBLM7G1822S-20PB ADS-2012 ModelSimulation modelzip2014-06-06
sot1212-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
sot1211-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2013-06-25
订购信息
型号订购码 (12NC)可订购的器件编号
BLM7G1822S-20PB9340 683 55518BLM7G1822S-20PBY
BLM7G1822S-20PBG9340 683 56518BLM7G1822S-20PBGY
模型
标题类型日期
BLM7G1822S-20PBG ADS-2012 ModelSimulation model2014-06-06
BLM7G1822S-20PB ADS-2012 ModelSimulation model2014-06-06
其它
标题类型日期
PCB Design BLM7G1822S-20PB(G) (Data sheet)Design support2014-05-22
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB
BLM7G1822S-20PBG ADS-2012 Model BLM7G1822S_20PB_G
BLM7G1822S-20PB ADS-2012 Model BLM7G1822S_20PB_G
PCB Design BLM7G1822S-20PB(G) (Data sheet) BLM7G1822S_20PB_G
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