BLM7G1822S-80AB(G):LDMOS 2级功率MMIC

BLM7G1822S-80AB(G)是双扇区2级非对称功率MMIC,使用恩智浦最先进的GEN7 LDMOS技术。该多频段器件非常适合采用Doherty配置的小型基站最终产品,或频率范围为1805 MHz至2170 MHz的通用驱动器。采用鸥翼式或直引脚外形。

特性和优势
    • 设计用于宽带操作(频率范围:1805 MHz至2170 MHz)
    • 可实现多个组合的扇区间高隔离度
    • 高效Doherty,获益于2 : 1非对称性
    • 集成式温度补偿偏置
    • 单级偏置从外部进行访问
    • 集成式ESD保护
    • 极佳的热稳定性
    • 高功率增益
    • 片上匹配,便于使用
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 适合1805 MHz至2170 MHz频率范围内W-CDMA基站的RF功率MMIC。可能的电路拓扑结构如下:
      • Doherty配置的非对称末级
      • 非对称驱动器,适合于高功率Doherty放大器
    • Doherty配置的非对称末级
    • 非对称驱动器,适合于高功率Doherty放大器
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLM7G1822S-80ABSOT1211-11805217080282428.31-c WCDMA; 1-c WCDMAProduction
BLM7G1822S-80ABGSOT1212-11805217080282428.31-c WCDMA; 1-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLM7G1822S-80AB
HSOP16F
(SOT1211-1)
sot1211-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-80ABY( 9340 687 26518 )
BLM7G1822S-80ABG
HSOP16
(SOT1212-1)
sot1212-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-80ABGY( 9340 687 27518 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLM7G1822S-80ABBLM7G1822S-80ABY33
BLM7G1822S-80ABGBLM7G1822S-80ABGY33
文档资料
档案名称标题类型格式日期
BLM7G1822S-80AB_S-80ABG (中文)LDMOS 2-stage power MMICData sheetpdf2015-07-01
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G1822S-80AB_S-80ABG_Data-sheetPCB Design BLM7G1822S-80AB(G) (Data sheet)Design supportzip2014-12-01
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot1212-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
sot1211-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2013-06-25
订购信息
型号订购码 (12NC)可订购的器件编号
BLM7G1822S-80AB9340 687 26518BLM7G1822S-80ABY
BLM7G1822S-80ABG9340 687 27518BLM7G1822S-80ABGY
其它
标题类型日期
PCB Design BLM7G1822S-80AB(G) (Data sheet)Design support2014-12-01
LDMOS 2-stage power MMIC BLM7G1822S_80AB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB
PCB Design BLM7G1822S-80AB(G) (Data sheet) BLM7G1822S_80AB_G